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Indexed by:期刊论文

Date of Publication:2017-07-10

Journal:Journal of Physics: Conference Series

Included Journals:Scopus、EI、CPCI-S

Volume:842

Issue:1

ISSN No.:17426588

Abstract:The inclined bimaterial interface crack problem is studied from theoretical and computational aspects. The original problem is transformed into an eigen value problem by using the symplectic approach, and the eigen solution are obtained. A Symplectic Analytical Singular Element (SASE), of which the interior fields are described by the obtained eigen solutions, is developed. The stress intensity factors (SIFs) can be calculated directly without any post-processing. Numerical example on a square bimaterial plate containing an inclined crack is provided to validate the proposed method. The comparison of the predicted results with the existing result indicates that the proposed method is accurate for the modelling of the inclined bimaterial interface crack. ? Published under licence by IOP Publishing Ltd.