个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:哈尔滨工业大学
学位:博士
所在单位:机械工程学院
学科:机械电子工程. 精密仪器及机械
电子邮箱:xdwang@dlut.edu.cn
Thermal assisted ultrasonic bonding of multilayer polymer microfluidic devices
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论文类型:期刊论文
发表时间:2010-01-01
发表刊物:JOURNAL OF MICROMECHANICS AND MICROENGINEERING
收录刊物:SCIE、EI、Scopus
卷号:20
期号:1
ISSN号:0960-1317
摘要:A new approach to fabricating multilayer microfluidic devices of poly(methyl methacrylate) (PMMA) was presented. Substrates were preheated to 20-30 degrees C lower than glass transition temperature (T-g) of the material by a hot plate. Then low-amplitude ultrasonic vibration was employed to generate facial heat at the interface of the PMMA layers. Two crossover micro-separation channel networks and a micro mixer were integrated in a four-layer microfluidic device using this method. The burst pressure of the bonded channel was more than 0.65 MPa. In order to demonstrate the performance of this technique, as many as 12 PMMA layers with micro-channels were successfully bonded together at one time. The average depth loss ratio of micro-channels was 0.6% and the tensile strength was 0.67 MPa. Multilayer poly(ethylene terephthalate) (PET) and cyclo-olefin polymer (COP) substrates were also successfully bonded. This study provided a potential method for constructing complex channel networks for polymer microfluidic devices.