Release Time:2022-10-19 Hits:
First Author: Zhang Li
Disigner of the Invention: 季炳成,张健豪,张昊然,时洪雷
Institution: 电子信息与电气工程学部
Application Number: CN104730386A
Authorization Number: CN201510128697.5
Next One:混合型超级电容器的封装结构