Current position: Aimin Wu >> Scientific Research >> Paper Publications

Study on the electronmigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls

Release Time:2023-03-30  Hits:

Date of Publication: 2022-10-09

Journal: 17th International Conference on Electronic Packaging Technology Wuhan

Institution: 材料科学与工程学院

Volume: 1

Issue: 1

Page Number: 524-527

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