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New two-step growth of microcrystalline silicon thin films without incubation layer

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Indexed by:期刊论文

Date of Publication:2011-05-01

Journal:JOURNAL OF CRYSTAL GROWTH

Included Journals:SCIE、EI

Volume:322

Issue:1

Page Number:1-5

ISSN No.:0022-0248

Key Words:Crystal structure; Etching; Chemical vapor deposition processes; Two-step growth; Semiconducting silicon; Solar cells

Abstract:A new two-step growth method was proposed to fabricate microcrystalline silicon (mu c-Si:H) thin films by an electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD). An ultra thin Si film was first deposited and followed by H(2) plasma treatment for few minutes, and then the mu c-Si:H film was deposited on it. High-resolution transmission electron microscope (HRTEM) and Raman spectrometer were used to study the microstructures and the crystalline volume fraction of mu c-Si:H films. The HRTEM results show that the amorphous silicon thin film with a thickness of 15 nm can be crystallized by H(2) plasma treatment in 2 min, and then it serves as the seed layer for the subsequent growth of mu c-Si:H films. By optimizing the deposition parameters, the mu c-Si:H film without amorphous incubation layer can be fabricated by this new two-step method and a proper crystalline volume fraction of 50.6% can be obtained. (C) 2011 Elsevier B.V. All rights reserved.

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