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磁控溅射工艺中靶材溅射功率对BCMg薄膜性能影响

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Indexed by:期刊论文

Date of Publication:2014-05-14

Journal:大连理工大学学报

Included Journals:PKU、ISTIC、CSCD

Volume:54

Issue:3

Page Number:298-302

ISSN No.:1000-8608

Key Words:BCMg;磁控溅射;非晶;力学性能

Abstract:采用多靶磁控共溅射技术,利用高纯B、C及 Mg单质靶材为溅射源,573 K 下在单晶Si(001)表面成功制备硬质非晶态BCMg薄膜.背散射扫描电镜(SEM)图显示薄膜成分均匀,与基体 Si片结合良好.X射线光电子能谱(XPS)分析表明薄膜中存在B-B、B-C、C-Mg等键态.X射线衍射仪(XRD)及高分辨透射电镜(HRTEM)测试结果表明薄膜为非晶态结构.某单质靶材溅射功率提高时,沉积速率及相应元素在薄膜中的含量随之上升.随着薄膜中 B含量增加,薄膜中B-B共价键数量增多,BCMg薄膜硬度与断裂韧性均上升.B含量为85%时,BCMg薄膜硬度及断裂韧性分别达到33.9 GPa及3 MPa·m1/2.

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