Release Time:2019-10-19 Hits:
First Author: 胡小刚
Disigner of the Invention: 谷伟,陈大民,李冬梅,John Wu,董闯
Application Number: CN201820025687.8
Authorization Date: 2018-01-08
Authorization Number: CN208008886U
Prev One:热弧蒸发多腔体钠米粉体制备装置
Next One:一种超厚Ti<sub>2</sub>AlC涂层的制备方法