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原位双相颗粒增强铜基复合材料

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First Author:WANG Tongmin

Disigner of the Invention:邹存磊,Kang Huijun,Chen Diffen,Yiping Lu,jiejinchuan,Yubo ZHANG,caozhiqiang,litingju

Application Number:2017105983474

Authorization Date:2017-07-21

Authorization number:2017105983474

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