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原位双相颗粒增强铜基复合材料

Release Time:2021-01-05  Hits:

First Author: 王同敏

Disigner of the Invention: 邹存磊,康慧君,Chen Diffen,Yiping Lu,接金川,Yubo ZHANG,曹志强,李廷举

Application Number: 2017105983474

Authorization Date: 2017-07-21

Authorization Number: 2017105983474

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