Hits:

Indexed by:期刊论文

Date of Publication:2016-01-27

Journal:JOURNAL OF PHYSICS D-APPLIED PHYSICS

Included Journals:SCIE、EI、Scopus

Volume:49

Issue:3

ISSN No.:0022-3727

Key Words:electrical resistivity; cluster-plus-glue-atom model; short-range order; Cu alloys; ternary alloys

Abstract:The electrical resistivity of metallic alloys is known to be largely affected by chemical short-range ordering. In accordance with the cluster-plus-glue-atom model for solid solutions, the present paper interpreted the composition versus resistivity behavior of Cu-Ni-Mo ternary alloys. The presence of Mo-centered [Mo-Ni-12] nearest-neighbor clusters is assumed, as the result of the negative enthalpy of mixing between Mo and Ni. The residual electrical resistivities are then correlated to the scattering from the [Mo-Ni-12] clusters, plus that from extra Ni solutes in solution with Cu for Mo/Ni < 1/12 or from Mo precipitates for Mo/Ni > 1/12. Such a cluster-based mechanism explains perfectly the experimental resistivity data, with the additional resistivities from the cluster, Ni solute, and Mo precipitate being, respectively, 1.08, 1.21, and 0.09 ( 10(-8) Omega m). The present work provides a simple method for the electrical resistivity manipulation of metallic alloys.