Hits:
First Author:胡小刚
Disigner of the Invention:dongchuang,John Wu,李冬梅,陈大民,谷伟
Application Number:CN201810069788.X
Authorization Date:2018-01-24
Authorization number:CN108165944A
Pre One:一类镍基单晶高温合金Nideal 3
Next One:一种立方棋盘状γ`相增强Cu‑Ni‑Al耐高温合金及其制备方法