董闯

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:法国洛林国立综合理工学院

学位:博士

所在单位:材料科学与工程学院

电子邮箱:dong@dlut.edu.cn

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Characteristics of Cu Film Deposited Using VLPPS

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论文类型:期刊论文

发表时间:2011-01-01

发表刊物:International Thermal Spray Conference

收录刊物:SCIE、EI、CPCI-S、Scopus

卷号:20

期号:1-2

页面范围:351-357

ISSN号:1059-9630

关键字:VLPPS; Cu; Film; Spectral diagnostic; Electronic temperature

摘要:Cu coatings were obtained by the very low pressure plasma spray (VLPPS) process using a torch F4-VB. The tank pressure was varied from 1 to 5 mbar: these specific conditions can be allowed to obtain a higher vapor condensation fraction in the coating. Different sizes of powders are used to compare the vaporization level. The other possible influencing factors for obtaining compact film-like coating are also considered such as the distance between the torch and substrate, the orientation of the vapors and also the substrate temperatures. Microstructures of coatings are analyzed and combined with the results of plasma diagnostics. Jobin-Yvon spectrometer (type TRIAX190, UK) and Plasus Specline Spectroscopy software are both used for detecting and analyzing plasma spectrum data. The value of plasma electronic excited temperature T (e) was calculated through choosing H-alpha and H-beta two atom spectra. The results showed that the plasma belongs to cold plasma in the local thermodynamic equilibrium situation in VLPPS.