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论文类型：期刊论文

发表时间：2010-08-27

发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS

收录刊物：SCIE

卷号：505

期号：1

页面范围：179-182

ISSN号：0925-8388

关键字：Cu-Ni; Cluster-plus-glue-atom model; Corrosion

摘要：Minor M (M = Fe, Mn, Cr) additions are widely added to enhance the corrosion resistance of commercial cupronickel alloys. The present paper aims at optimizing the amounts of M in Cu-70(Ni,Fe,Mn,Cr)(30) (at.%) alloys using a cluster-plus-glue-atom model for stable solid solutions. By this model, it assumed that 1 M atom and 12 Ni atoms formed an M-centered and Ni-surrounded cube-octahedron cluster and the isolated M1Ni12 clusters are embedded in a Cu matrix, conforming to a cluster formula [M1Ni12]Cu-30.3 = [Mu(1/13)Ni(12/13)](30)Cu-70. A structure of this kind satisfies ideally the nearest neighbor requirement, i.e. only M-Ni and Ni-Cu neighbors are allowed and the unfavorable Cu-M pairs are avoided, and hence it describes a stable solid solution structure with good thermal stability. Electrochemical corrosion measurements indicated that [(Fe0.6Mn0.25Cr0.15)(1)Ni-12]Cu-30.3 had the best corrosion resistance in 3.5% NaCl aqueous solution. (C) 2010 Elsevier B.V. All rights reserved.