Hits:
Date of Publication:2010-01-01
Journal:电镀与精饰
Issue:9
Page Number:1-4
ISSN No.:1001-3849
Note:新增回溯数据
Pre One:Cu纳米粉的制备及其导电性能研究
Next One:直流电弧法制备硅纳米线及其电化学性能