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导电涂料中纳米铜粉抗氧化性的研究

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Indexed by:期刊论文

Date of Publication:2022-06-30

Journal:材料科学与工艺

Volume:16

Issue:6

Page Number:826

ISSN No.:1005-0299

Abstract:Cu nanoparticles were encapsulated in Ag shell for a better
   conductivity,antioxidation and improved particle dispersion.The surface
   of Cu nanoparticles was activated by C32H64O4Sn,and then reacted in a
   solution of AgNO3 to fabricate Cu-Ag bimetallic nanoparticles through
   the chemical dispalcement reaction method.Hydrazine hydrate was served
   as the reducer,PVP and KH-550 as the dispersants.The mean particle size
   and characteristics of Cu-Ag bimetallic nanoparticles were similar to
   the original Cu nanoparticles.The antioxidation behavior of
   nanoparticles was investigated by means of XRD,XRF and TGA.The
   nanoparticle morphologies were observed by TEM.It is indicated that the
   core/shell type microstructure can be formed as the content of Ag
   reaches about 37.68wt% in Cu-Ag bimetallic nanoparticles which can not
   be oxidized till to 700 ℃ in air.

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