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论文类型：期刊论文

发表时间：2010-07-23

发表刊物：VACUUM

收录刊物：SCIE、EI

卷号：85

期号：1

页面范围：1-4

ISSN号：0042-207X

关键字：TIN/TIC multilayer films; Pulse biased arc ion plating; Microhardness; Film/substrate adhesion

摘要：TiN/TiC multilayer films were deposited on high-speed-steel (HSS) substrates using pulse biased arc ion plating. For comparison, TiN and TIC films were also deposited. Scanning electron microscopy (SEM), X-ray diffraction (XRD) and Auger electron spectroscopy (AES) were applied to investigate the modulation period thickness, microstructure and content depth distribution of the films, respectively. And microhardness and film/substrate adhesion were also analyzed using knoop tester and scratching method. The results showed that the multilayer films with different modulation period of 40-240 nm exhibit a modulation structure and the interface width is about 20 similar to 30 nm. Microhardness of the multilayer films were not obviously improved compared to that of TiN and TIC film, and the reason was analyzed. In comparison to TIN film, film/substrate adhesion values of the multilayer films were deteriorated with the increasing of modulation period due to the brittle characteristics of TIC film. (C) 2009 Published by Elsevier Ltd.