Spectral collocation method for transient thermal analysis of coupled conductive, convective and radiative heat transfer in the moving plate with temperature dependent properties and heat generation
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论文类型：期刊论文
发表时间：2017-11-01
发表刊物：INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
收录刊物：SCIE、EI
卷号：114
页面范围：469-482
ISSN号：0017-9310
关键字：Coupled conductive; Convective and radiative heat transfer; Transient thermal process; Moving plate; Temperature dependent heat generation; Spectral collocation method
摘要：The spectral collocation method is developed and formulated to solve transient thermal process in the moving plate with temperature dependent properties and heat generation. In this moving plate, thermal conductivity and surface emissivity are assumed as linear functions of temperature; and heat transfer coefficient and heat generation are considered as power exponent functions of temperature. The time domain of energy equation is discretized by fully implicit Euler scheme; the spatial domain of energy equation is discretized by Chebyshev polynomials and Chebyshev collocation points. Numerical results by the spectral collocation method are compared with analytical solutions. This comparison indicates that the spectral collocation method can obtain very high accuracy even using few nodes. Meanwhile, the spectral collocation method can provide the exponential node convergence rate for this present problem. Moreover, the effects of various dimensionless parameters, such as Peclet number, heat generation parameters, thermal conductivity coefficient, surface emissivity coefficient, power exponent of heat transfer coefficient, convective-conductive parameter, radiative-conductive parameter and dimensionless ambient temperature on transient temperature, efficiency and effectiveness of the moving plate are comprehensively investigated. (C) 2017 Elsevier Ltd. All rights reserved.
发表时间：2017-11-01