李经民

个人信息Personal Information

教授

博士生导师

硕士生导师

任职 : 中国地面机器系统学会委员,中国微米纳米技术学会青年工作委员会委员,中国微米纳米技术学会制造及装备分会秘书,中国机械工程学会高级会员,大连医科大学附属第一医院康复医疗器械专家工作站设站专家

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:机械工程学院

学科:机械电子工程

办公地点:知方楼6011

联系方式:0411-84707713-8118

电子邮箱:jingminl@dlut.edu.cn

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微器件快速柔性胶粘接封合机研制

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论文类型:期刊论文

发表时间:2022-06-30

发表刊物:机械设计与制造

期号:5

页面范围:182-185

ISSN号:1001-3997

摘要:In order to decrease the defect of adhesive bonding process and increase the bonding rate,a fast,room-temperature adhesive bonding process has been developed for fabrication of microfluidic chips.According to this process,we developed a flexible material based adhesive bonding machine.A pneumatic-hydraulic cylinder was used in this machine.The pressure head was made of flexible material,fixed by a floating joint under the pneumatic-hydraulic cylinder.It moved through the sliding bearings,which was fixed in the frame.This machine was driven by pneumatic system.For the concern of safety,this bonding machine only can be started by two hands,and the pneumatic system can control the bonding pressure by pressure regulator and the bonding times by timer.The pressure head can return to original position automatically after achieving bonding time.This machine can improve the automation of adhesive bonding process,which only can be achieved by hands right now.

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