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论文类型：期刊论文

发表时间：2009-12-01

发表刊物：MATERIALS & DESIGN

收录刊物：SCIE、EI、Scopus

卷号：30

期号：10

页面范围：4548-4551

ISSN号：0261-3069

摘要：The diffusion bonding of Mg and Al alloys with different interlayer compositions was investigated, where the interlayer was prepared through hot dipping technique in pure Zn, Zn-8Al and Zn-5Al baths, respectively. By means of microstructure characterization and strength measurement, it is found that the interlayer obtained in Zn-5Al bath led to the formation of interface microstructure composed of mini Al-rich particles dispersed in MgZn(2) phase, this kind of phases constituent decreases the risk of embrittlement of entire diffusion bonding joint and benefits its mechanical performance greatly. (C) 2009 Elsevier Ltd. All rights reserved.