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Indexed by:期刊论文

Date of Publication:2017-05-01

Journal:CHINA FOUNDRY

Included Journals:SCIE、Scopus

Volume:14

Issue:3

Page Number:194-198

ISSN No.:1672-6421

Key Words:Al-Cu clad materials; interface; solid-liquid method; microstructure

Abstract:The solid-liquid method was used to prepare the continuous casting of copper cladding aluminium by liquid aluminum alloy and solid copper, and the interfacial phase formation of Al-Cu bimetal at different pouring temperatures (700, 750, 800 degrees C) was investigated by means of metallograph, scanning electron microscopy (SEM) and energy dispersive spectrometry (EDS) methods. The results showed that the pouring temperature of aluminum melt had an important influence on the element diffusion of Cu from the solid Cu to Al alloy melt and the reactions between Al and Cu, as well as the morphology of the Al-Cu interface. When the pouring temperature was 800 degrees C, there were abundant Al-Cu intermetallic compounds (IMCs) near the interface. However, a lower pouring temperature (700 degrees C) resulted in the formation of cavities which was detrimental to the bonding and mechanical properties. Under the conditions in this study, the good metallurgical bonding of Al-Cu was achieved at a pouring temperature of 750 degrees C.