Release Time:2019-03-09 Hits:
First Author: 李廷举
Disigner of the Invention: 刘宁,Yiping Lu,曹志强,张忠涛,王同敏
Application Number: CN201110136244.9
Authorization Date: 2011-05-24
Authorization Number: CN102211175A
Prev One:长寿命铝硅合金晶粒细化剂及其制备方法
Next One:半固态合金成型工艺及其所用成型装置