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论文类型：期刊论文

发表时间：2009-09-18

发表刊物：JOURNAL OF ALLOYS AND COMPOUNDS

收录刊物：SCIE

卷号：484

期号：1-2

页面范围：458-462

ISSN号：0925-8388

关键字：Microstructure; Ultrasonic; Metallography; Scanning electron microscopy

摘要：Compound field (combination of power ultrasonic field and rotating electromagnetic field) was used to modify the microstructure of A356 alloy. The effect of compound field on the solidification of the A356 alloy was investigated and the obtained samples were characterized by optical microscopy and scanning electron microscopy (SEM). The results showed that: (1) both the primary aluminum and eutectic silicon were significantly refined; (2) the dendritic primary aluminum became spherical, and the plate-like eutectic silicon turned into rod-like during the solidification process under compound field. The mechanism of the microstructure evolution under compound field was also preliminarily discussed. (C) 2009 Elsevier B.V. All rights reserved.