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Date of Publication:2024-05-31
Journal:Case Studies in Thermal Engineering
Volume:59
ISSN:2214-157X
Key Words:Chip configuration; Convolution; Convolutional neural network; Convolutional neural networks; Data set size; Heat transfer; Learning approach; Learning systems; Microprocessor chips; Multi chip modules; Neural network model; Temperature reconstruction; Thermal; Thermal designs; Transfer learning