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论文类型：期刊论文

发表时间：2009-08-01

发表刊物：JOURNAL OF MICROMECHANICS AND MICROENGINEERING

收录刊物：SCIE、EI、Scopus

卷号：19

期号：8

ISSN号：0960-1317

摘要：A novel model was established to investigate the effects of the initial stencil width on stainless steel wet chemical etching. This model was derived to correlate the etching depth with the initial stencil width, etching time and other parameters. Coefficient of determination (COD) was applied to check the fitting accuracy of the model. The model showed good predictive capability for the initial stencil widths ranging from 50 mu m to 500 mu m. From the derivations of the model, it was found that the etching rate is controlled by the ratio of the area being etched to the area of the stencil opening. Explanations for the variation of the etching depth versus the initial stencil width were also given through a series of mathematical derivations. The limitation of the model and the corresponding reasons were also discussed. This model can be used to predict the etching depth in practical productions when the etching time and the initial stencil width are given.