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面向3D打印的多尺度孔洞结构轻量化建模方法

Release Time:2022-10-20  Hits:

First Author: Shengfa Wang

Disigner of the Invention: 胡江北,LI Baojun,Luo Zhongxuan

Institution: 国际信息与软件学院

Application Number: CN107885945A

Authorization Number: CN201711170375.2

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