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高耐久性无粘结剂封装光纤光栅应变传感器及封装方法

Release Time:2022-10-20  Hits:

First Author: Xuefeng Zhao

Disigner of the Invention: 刘庆,吕兴军,单水军,江元浩

Institution: 建设工程学部

Application Number: CN103335605A

Authorization Number: CN201310284802.5

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