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论文类型：期刊论文

发表时间：2013-07-01

发表刊物：JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME

收录刊物：SCIE、EI、Scopus

卷号：80

期号：4

ISSN号：0021-8936

关键字：transfer printing; viscoelasticity; interfacial fracture toughness; pulling speed; pull-off force

摘要：Transfer printing is a volatile tool to retract micro devices from a donor substrate via elastomeric stamps, from which the devices are grown or fabricated, followed by printing to a receiver substrate where the device is assembled to an array for integration in various applications. Among the five approaches of transfer printing summarized in the paper, the viscoelastic property of stamps is widely adopted to modulate the interfacial adhesion between the stamp and devices by applying different pulling speeds. A viscoelastic model for transfer printing is analytically established. It shows that the interfacial adhesion increases with pulling speed, which is verified by the experiments and numerical simulations.