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论文类型：期刊论文

发表时间：2010-12-01

发表刊物：ACTA MECHANICA SINICA

收录刊物：SCIE、EI、ISTIC、Scopus

卷号：26

期号：6

页面范围：881-888

ISSN号：0567-7718

关键字：Strain isolation; Thin film; Substrate; Adhesive; Stretchable electronics

摘要：Stretchable electronics represents a direction of recent development in next-generation semiconductor devices. Such systems have the potential to offer the performance of conventional wafer-based technologies, but they can be stretched like a rubber band, twisted like a rope, bent over a pencil, and folded like a piece of paper. Isolating the active devices from strains associated with such deformations is an important aspect of design. One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple, analytical model and validates the results by the finite element method. The results show that a relatively thick, compliant adhesive is effective to reduce the strain in the electronics, as is a relatively short film.