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一种利用含硅尾矿制备轻质多孔保温砖的方法

Release Time:2020-02-17  Hits:

First Author: 宁桂玲

Disigner of the Invention: 林源,田朋,鹿晓斌,包良清,颜峰

Application Number: CN200710012589.7

Authorization Date: 2007-08-24

Authorization Number: CN101143768

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