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位错对薄硅片激光弯曲过程的影响
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发表时间: 2022-10-04
发表刊物: 中国激光
所属单位: 机械工程学院
期号: 5
页面范围: 772-775
ISSN号: 0258-7025
摘要: Based on slip line and stacking fault appeared on the silicon surface, the dislocation theory is used to analyze the reasons of causing dislocation and stacking fault during the bending process and study their influence on the laser bending, according to the experiment of thin silicon laser bending. The analyzed results indicate that the slip line is caused by the dislocation accumulation, and the stacking fault is the results of piled dislocation. Meanwhile influence of the dislocation density and dislocation moving velocity on the process of laser bending is analyzed. The changing process of dislocation density and the deceased dislocation moving velocity are considered to form maximal angle.
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牛方勇

副教授   博士生导师   硕士生导师

性别: 男

毕业院校:大连理工大学

学位: 博士

所在单位:机械工程学院

学科:机械制造及其自动化

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