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论文类型：期刊论文
发表时间：2011-09-15
发表刊物：JOURNAL OF APPLIED POLYMER SCIENCE
收录刊物：Scopus、SCIE、EI
卷号：121
期号：6
页面范围：3122-3130
ISSN号：0021-8995
关键字：epoxy resin; bismaleimide; blends; thermal properties; fracture toughness
摘要：A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,40-diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (T(p)) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high-temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G') in the glassy region while glass transition temperature (T(g)) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. (C) 2011 Wiley Periodicals, Inc. J Appl Polym Sci 121: 3122-3130, 2011