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一种多孔高传质PVA包埋载体及其制备方法

Release Time:2019-10-22  Hits:

First Author: Sen Qiao

Disigner of the Invention: 段秀梅,金若菲,周集体

Application Number: CN201210060681.1

Authorization Date: 2012-03-08

Authorization Number: CN102586221A

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