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Shengfa Wang
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Associate Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[11]Shengfa Wang, Hou, Tingbo, Su Zhixun.Multi-scale anisotropic heat diffusion based on normal-driven shape representation[J],VISUAL COMPUTER,2022,27(6-8):429-439
[12]Shengfa Wang, Zhaohuan Ye, Hu Jiangbei, Bin Liu, Luo Zhongxuan.Design and optimization of bionic bone with micropore structure suitable for 3D printing[A],ICDH,2022
[13]Jiang, Yu, Shengfa Wang, Wang, Heting, LI Baojun, Wenbin Hou.Crashworthiness Design of Thin-Walled Tubes Reinforced by Triply Periodic Minimal Surfaces[J],3D PRINTING AND ADDITIVE MANUFACTURING,2022,8(2):99-109
[14]Sun, Riming, Yang, Yichen, Ma, Yongfeng, Shengfa Wang.A transmission model for motion estimation of instability space targets[A],COMPUTERS & GRAPHICS-UK,2022,98:29-36
[15]Ge, Jingyi, Yi Wang, Li, Jiayi, Bai, Huiwen, Liu, Linsheng, Shengfa Wang, Xue Xinwei, Fengqi Li.A Reinforcement Learning-based Path Planning Method for Complex Thin-walled Structures in 3D Prin...[A],ACM International Conference Proceeding Series,2022,PartF171546:234-240
[16]Shengfa Wang, Hou, Tingbo, Li, Shuai, Su Zhixun, qinhong.Anisotropic Elliptic PDEs for Feature Classification[J],IEEE TRANSACTIONS ON VISUALIZATION AND COMPUTER GRAPHICS,2022,19(10):1606-1618
[17]Shengfa Wang.A Novel Material-aware Feature Descriptor for Volumetric Image Registration in Diffusion Tensor S...[A],European Conference on Computer Vision,2022,493-506
[18]Su Zhixun, Shengfa Wang, yuchao, liufeng, Shi X..A novel Laplacian based method for mesh deformation[J],Journal of Information and Computational Science,2022,7(4):877-884
[19]Yin, Huishu, Shengfa Wang, wangyi, Fengqi Li, tianlinlin, Xue Xinwei, Jia Qi.An Intelligent 3D Printing Path Planning Algorithm 3D Printing Path Planning Algorithm: An Intell...[A],ACM International Conference Proceeding Series,2022,PartF171546:241-246
[20]Xin Fan, Chai, Zhi, Feng, Yuyao, Yi Wang, Shengfa Wang, Luo Zhongxuan.An efficient mesh-based face beautifier on mobile devices[J],NEUROCOMPUTING,2022,172(,SI):134-142
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