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面向3D打印的多尺度孔洞结构轻量化建模方法

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First Author:Shengfa Wang

Disigner of the Invention:Hu Jiangbei,LI Baojun,Luo Zhongxuan

Affilication of Author(s):国际信息与软件学院

Application Number:CN107885945A

Authorization number:CN201711170375.2

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