孙长凯

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:第四军医大学

学位:博士

所在单位:人工智能学院

学科:生物医学工程

办公地点:大连理工大学创新园大厦B1202

联系方式:sunck2@dlut.edu.cn

电子邮箱:sunck2@dlut.edu.cn

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Biodegradable and electroconductive poly(3,4-ethylenedioxythiophene)/carboxymethyl chitosan hydrogels for neural tissue engineering.

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论文类型:期刊论文

发表时间:2018-01-01

发表刊物:Materials science & engineering. C, Materials for biological applications

收录刊物:PubMed、SCIE、EI

卷号:84

页面范围:32-43

ISSN号:1873-0191

关键字:Poly(3,4-ethylenedioxythiophene); Carboxymethyl chitosan; Conductive hydrogel; Biodegradable; Neural tissue engineering

摘要:Electroconductive hydrogels with excellent electromechanical properties have become crucial for biomedical applications. In this study, we developed a conductive composite hydrogel via in-situ chemical polymerization based on carboxymethyl chitosan (CMCS), as a biodegradable base macromolecular network, and poly(3,4-ethylenedioxythiophene) (PEDOT), as a conductive polymer layer. The physicochemical and electrochemical properties of conductive hydrogels (PEDOT/CMCS) with different contents of PEDOT polymer were analyzed. Cell viability and proliferation of neuron-like rat phaeochromocytoma (PC12) cells on these three-dimensional conductive hydrogels were evaluated in vitro. As results, the prepared semi-interpenetrating network hydrogels were shown to consist of up to 1825±135wt% of water with a compressive modulus of 9.59±0.49kPa, a porosity of 93.95±1.03% and an electrical conductivity of (4.68±0.28)*10-3S·cm-1. Cell experiments confirmed that PEDOT/CMCS hydrogels not only had no cytotoxicity, but also supported cell adhesion, viability and proliferation. These results demonstrated that the incorporation of conductive PEDOT component into CMCS hydrogels endowed the hydrogels with enhanced mechanical strength, conductivity and kept the biocompatibility. Thus, the attractive performances of these composite hydrogels would make them suitable for further neural tissue engineering application, such as nerve regeneration scaffold materials. Copyright © 2017 Elsevier B.V. All rights reserved.