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论文类型：期刊论文

发表时间：2012-11-01

发表刊物：COMPOSITE STRUCTURES

收录刊物：SCIE、EI、Scopus

卷号：94

期号：11

页面范围：3232-3239

ISSN号：0263-8223

关键字：Adhesion; Debonding; Interface; Analytical modeling

摘要：Interfacial behavior is critical to composite structures and materials reinforced by externally bonded reinforcement. Numerous empirical and semi-empirical models have been developed for evaluating interfacial bond strength. Analytical solutions have been derived for interfaces with infinite bond lengths, but no closed-form solutions have been derived for the bond strength of an interface with an arbitrary bond length. An analytical solution is derived in this work for the strength of a general externally bonded interface. With the analytical method, the interesting snapback phenomenon in simple pull-off tests is theoretically studied, and an invariant is identified as the condition for it to occur. Furthermore, a methodology is provided to evaluate the interfacial material properties based on a given empirical bond model. (C) 2012 Elsevier Ltd. All rights reserved.