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论文类型：期刊论文

发表时间：2017-07-01

发表刊物：MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

收录刊物：SCIE、EI、Scopus

卷号：23

期号：7

页面范围：2943-2950

ISSN号：0946-7076

摘要：In this work, a micro punching equipment was designed and assembled for punching components with micro hole array. Micro hole array in 800 mu m scale was punched successfully on blanked parts using this equipment. Punch experiments under different punch conditions were conducted to explore the effect laws of cavity depth, punch force and punch speed on punching process and quality of punched holes. To improve the process performance of the developed equipment, an ultrasonic vibration module was designed and assembled to the existing system based on its function of softening materials, the equipment's process parameter scope such as cavity depth was optimized then. The results in this work proved the practicability of the developed micro punching equipment for punching components with micro hole array, the influence mechanism of punching conditions on punching process, and the optimization function of ultrasonic vibration on micro punching process, which could be useful in improving machining efficiency and cost of punch fabrication.