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论文类型：会议论文

发表时间：2012-10-27

收录刊物：EI、CPCI-S、Scopus

卷号：256-259

期号：PART 1

页面范围：2867-+

关键字：Thermal Mismatch Stress; Numerical Modeling; Crack Growth; Heterogeneity

摘要：A numerical method RFPA-T (Thermal Induced Rock Failure Process Analysis) code is used to study the thermal cracking processes of quasi-brittle materials subjected to high or low temperature. The numerical results indicate that thermal stress concentrating along the interface between the matrix and the embedded grains due to their different coefficient of thermal expansion (CTE). The modeling results indicate that theta-crack is generated during temperature increment as the CTE of the embedded grain is smaller than that of the matrix. However, radial-cracks emerged when the temperature decrease. The results obtained from RFPA-T code show a good agreement with experimental evidence of crack patterns caused by thermal expansion mismatch.