王同敏

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:研究生院常务副院长

其他任职:辽宁省凝固控制与数字化制备技术重点实验室主任

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

学科:材料加工工程

办公地点:研究生院;材料科学与工程学院

联系方式:tmwang@dlut.edu.cn

电子邮箱:tmwang@dlut.edu.cn

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A nano-micro dual-scale particulate-reinforced copper matrix composite with high strength, high electrical conductivity and superior wear resistance

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论文类型:期刊论文

发表时间:2018-01-01

发表刊物:RSC ADVANCES

收录刊物:SCIE

卷号:8

期号:54

页面范围:30777-30782

ISSN号:2046-2069

摘要:Due to the contradiction between mechanical properties and electrical conductivity, it is not easy to fabricate materials with both high strength and good wear resistance with favourable electrical conductivity for the application of electrical materials. In addition, strength and wear resistance do not always present a uniform growth trend at the same time. Herein, a novel copper matrix composite reinforced by in situ synthesized ZrB2 microparticles and nano Cu5Zr precipitates is successfully prepared by a casting method and sequential heat treatments. The Cu/dual-scale particulate composite possesses a desired trade-off of strength, electrical conductivity and wear resistance. ZrB2 microparticles form from Zr and B elements in copper melts, and nanoscale Cu5Zr precipitates form in the matrix after solid solution and aging treatments. The ZrB2 microparticles, nano Cu5Zr precipitates, and well-bonded interfaces contribute to a high tensile strength of 591MPa and superior wear resistance, with a relative electrical conductivity of 83.7% International Annealed Copper Standard.