王同敏

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:研究生院常务副院长

其他任职:辽宁省凝固控制与数字化制备技术重点实验室主任

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

学科:材料加工工程

办公地点:研究生院;材料科学与工程学院

联系方式:tmwang@dlut.edu.cn

电子邮箱:tmwang@dlut.edu.cn

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A promising structure for fabricating high strength and high electrical conductivity copper alloys

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论文类型:期刊论文

发表时间:2016-02-09

发表刊物:SCIENTIFIC REPORTS

收录刊物:SCIE、PubMed

卷号:6

页面范围:20799

ISSN号:2045-2322

摘要:To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3% Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu5Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.