王同敏

个人信息Personal Information

教授

博士生导师

硕士生导师

主要任职:研究生院常务副院长

其他任职:辽宁省凝固控制与数字化制备技术重点实验室主任

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

学科:材料加工工程

办公地点:研究生院;材料科学与工程学院

联系方式:tmwang@dlut.edu.cn

电子邮箱:tmwang@dlut.edu.cn

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Novel insight into mechanism of secondary phase's morphology evolution in hypomonotectic Cu-Pb-Sn alloy during solidification

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论文类型:期刊论文

发表时间:2019-10-15

发表刊物:JOURNAL OF MOLECULAR LIQUIDS

收录刊物:EI、SCIE

卷号:292

ISSN号:0167-7322

关键字:Cu-Pb-Sn alloy; Network; Rod-like; Phase-field calculation; Solidification; Morphology evolution

摘要:In the present study, hypomonotectic Cu-Pb-Sn alloys with Pb-rich secondary phase particles (SPPs) in different morphology were prepared at specific casting temperature (T-q) corresponding to different molar fraction (f(S0)) of the existing primary alpha-Cu (S-0) before pouring. The results show that the SPPs transform from continuously network to independently rod-like morphology and then become abnormally coarsening with increasing T-q. Phase field calculation was carried out to discuss the morphology evolution mechanism of the secondary phase droplets (L-2), which can effectively overcome the experimental difficulty of the investigation about the monotectic reaction with an extremely high reaction rate. It is found that f(s0) can strongly affect such morphology evolution. A relatively high f(s0) corresponding to a lower T-q is proven to promote the formation of network L-2. In contrast, a lower f(s0) corresponding to a higher T-q can promote the formation of rod-like L-2, which is mainly benefitted from the immiscibility of the Cu-rich residual liquid (L-1) and L-2. However, if T-q continuously increases, abnormally coarsening of L-2 will occur mainly through collision and coagulation driven by the Marangoni force and the solidification front's pushing. The coarsening process of L-2 during heating was observed through synchrotron radiation. This work reveals the morphology evolution mechanism of the SPPs in hypomonotectic Cu-Pb-Sn alloy during the monotectic reaction. (C) 2019 Elsevier B.V. All rights reserved.