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大连理工大学

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Business Address:大连理工大学西校区化工实验楼D段313室
E-Mail:rongfuwen@dlut.edu.cn

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Hydrophobic copper nanowires for enhancing condensation heat transfer

Date of Publication:2022-10-03 Hits:

Date of Publication:2022-10-03
Journal:Nano Energy
Affiliation of Author(s):化工学院
Volume:33
Page Number:177-183
ISSN No.:2211-2855