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大连理工大学

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Business Address:大连理工大学西校区化工实验楼D段313室
E-Mail:rongfuwen@dlut.edu.cn

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Photothermal superhydrophobic copper nanowire assemblies: fabrication and deicing/defrosting applications

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Journal:INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING
Volume:5
Issue:4
ISSN No.:2631-8644
Key Words:ADHESION; DEFENSE; DESIGN; ICE; SLIPPERY SURFACES