大连理工大学主页平台管理系统温荣福 Photothermal superhydrophobic copper nanowire assemblies: fabrication and deicing/defrosting applications Home

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Photothermal superhydrophobic copper nanowire assemblies: fabrication and deicing/defrosting applications

Release Time:2024-04-02 Hits:

Indexed by: Journal Papers
Document Code: 373535
Date of Publication: 2023-12-01
Journal: INTERNATIONAL JOURNAL OF EXTREME MANUFACTURING
Volume: 5
Issue: 4
ISSN: 2631-8644
Key Words: ADHESION; DEFENSE; DESIGN; ICE; SLIPPERY SURFACES
CN: 51-1794/TH

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Photothermal superhydrophobic copper nanowire assemblies: fabrication and deicing/defrosting applications