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大连理工大学

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Large-Scale Vapor Chambers Enabled by Liquid Film Boiling for High-Power Electronics Cooling

Release Time:2026-06-19 Hits:

Indexed by: Journal Papers
Document Code: 590015
Date of Publication: 2025-10-21
Journal: JOURNAL OF THERMAL SCIENCE
ISSN: 1003-2169
Key Words: THERMAL PERFORMANCE