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论文类型：会议论文

发表时间：2006-01-01

收录刊物：CPCI-S

页面范围：307-312

关键字：microgripper; UV-LIGA; SU-8 photoresist; electroplating

摘要：In the work presented in this article a compliant nickel electro-thermal microgripper was designed using topology optimization and a fabrication process for the high aspect ratio metal microgripper has been developed using UV-LIGA technology with photoresist EPON SU-8. An electro-thermal microgripper with the smallest feature size of 10 mu m and thickness of 40 mu m and low internal stress was gained. Final dynamic performance of the nickel microgripper was experimented within Ov similar to 2.5v range. The tweezing displacement of up to 67 mu m at 2.5v was recorded. Characterized structures behaved in accordance with the intended behaviors.