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论文类型：期刊论文

发表时间：2014-07-03

发表刊物：MATERIALS AND MANUFACTURING PROCESSES

收录刊物：SCIE、EI、Scopus

卷号：29

期号：7

页面范围：795-800

ISSN号：1042-6914

关键字：Activation; Adhesion; Current; Density; Electrochemical; Microelectroforming; Strength

摘要：Many electroforming microstructures need their substrates to be bonded with electroforming layers in micromanufacturing. A controlling current density method to improve the adhesion performance of the copper substrate to the nickel electroforming layer was presented. Lower direct current density was employed to activate the substrate. A scratch test was conducted to evaluate the adhesion strength quantitatively by observing the friction load versus the normal load and the scratch track using a digital microscope. The experimental results indicated that electrochemical activation occurred on the cathode surface with an initial current density of between 0.2 and 1.0A/dm(2). The adhesion performance of the activated substrate to the nickel layer was higher than that of a substrate without activation. While the direct current density was 0.4A/dm(2), the adhesion strength was the highest. Electrochemical activation at the beginning of microelectroforming can enhance the adhesion strength of microstructures.