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Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application

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Date of Publication:2022-10-03

Journal:IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY

Volume:11

Issue:2

Page Number:200-211

ISSN No.:2156-3950

Key Words:"Insulated gate bipolar transistors; Clamps; Stress; Thermal stresses; Heat sinks; Fixtures; Finite element analysis; Clamping area; finite-element method (FEM) model; press-pack insulated gate bipolar transistors (PP-IGBTs); thermomechanical performance"

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Next One:Study of Electrical Contacts Fatigue and Degradation Evaluation for Press Pack IEGT under Power Cycling Tests
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