Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application
Release Time:2024-03-08 Hits:
Date of Publication: 2022-10-03
Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume: 11
Issue: 2
Page Number: 200-211
ISSN: 2156-3950
Key Words: "Insulated gate bipolar transistors; Clamps; Stress; Thermal stresses; Heat sinks; Fixtures; Finite element analysis; Clamping area; finite-element method (FEM) model; press-pack insulated gate bipolar transistors (PP-IGBTs); thermomechanical performance"