个人信息Personal Information
副教授
博士生导师
硕士生导师
主要任职:电气工程学院副院长
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:电气工程学院
学科:电工理论与新技术. 电力电子与电力传动
办公地点:大连理工大学A3区32#静电与特种电源研究所204
电子邮箱:wangzq@dlut.edu.cn
Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant
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论文类型:期刊论文
发表时间:2020-11-01
发表刊物:IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
卷号:10
期号:11
页面范围:1849-1860
ISSN号:2156-3950
关键字:Metals; Insulated gate bipolar transistors; Magnetohydrodynamics; Water heating; Heat sinks; Packaging; High-voltage direct current (HVdc) cooling; junction temperature; liquid metal cooling; magnetohydrodynamic (MHD) pump; press-pack insulated-gate bipolar transistor (IGBT) power module cooling
摘要:The press-pack packaging technology has been adopted in recent years for insulated-gate bipolar transistors (IGBTs) to be utilized in high voltage-high current applications, such as high-voltage direct current (HVdc) electric power transmission. Traditionally, the heat management of such systems is based on water coolant; however, there are numerous challenges associated with that method, such as the requirement to deionize the water to prevent electrical potentials and inherent problems of corrosion and leakage in the cooling piping structure. This article presents the design and development of a liquid metal heat sink for press-pack IGBTs. The use of a thermal management system based on liquid metal increases the heat dissipation capability without corroding the cooling structure. Analytical work is performed on the design of the heat sink. Moreover, the thermal performance of the heat sink is experimentally validated against a commercial water-based cooling system. The presented results show that the cooling performance of the liquid metal system is increased, whereas the shortcomings of the water-based system are eliminated.