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论文类型： 会议论文

发表时间： 2007-06-26

收录刊物： EI、CPCI-S、Scopus

页面范围： 127-+

摘要： The growth behaviors of intermetallic compound (IMC) layers in solid-liquid interfacial reactions of Snl.5Cu/Cu in various intensities of high magnetic field have been investigated. The results show that the growth of IMC layers has been accelerated by high magnetic field through the comparison of growth kinetics of IMC layers among 0T to 2.5T magnetic field. IMC grains in. high magnetic field are much bigger than that in 0T. By the analyzing of XRD patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.