点击次数：

发布时间：2019-03-10

论文类型：期刊论文

发表时间：2009-01-01

发表刊物：SOLDERING & SURFACE MOUNT TECHNOLOGY

收录刊物：Scopus、CPCI-S、EI、SCIE

卷号：21

期号：2

页面范围：14-18

ISSN号：0954-0911

关键字：Solders; Composite materials; Magnetic fields; Physical properties of materials

摘要：Purpose - The aim of this paper is to investigate the growth behaviours of intermetallic compound (IMC) layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of high-magnetic field.
   Design/methodology/approach - Sn1.5Cu solder was prepared and melted in a vacuum furnace at 873 K and cast into solder bars. Samples were mounted using resin and etched after being carefully polished. Then the IMC layers were observed by using scanning electron microscopy.
   Findings - The results show that the growth of IMC layers has been accelerated by high-magnetic field through the comparison of growth kinetics of IMC layers among 0-2.5 T magnetic filed. IMC grains in high-magnetic field are much bigger than that in 0 T. By the analyzing of X-ray diffractometer patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.
   Originality/value - This paper investigates the growth behaviour of IMC layers during the solid-liquid interfacial reactions of Sn1.5Cu/Cu in a high magnetic field.