Xin Liu
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Influence of Cold Plasma on Material Removal Behavior During Scratching of Single Crystal Silicon
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Date of Publication:2024-10-07

Journal:SSRN

ISSN:1556-5068

Key Words:Atmospheric pressure; Cold plasmas; Cracks; Crystal material; Crystal orientation; Ductile fracture; Fracture mechanics; High hardness; Machined surface; Material removal behaviours; Microscopic cracks; Monocrystalline silicon; Removal behavior; Scratching; Silicon wafers; Single crystals; Single crystal silicon; Sub; surface damage

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Supervisor of Master's Candidates

Academic Titles:创新创业学院院长

Gender:Male

Alma Mater:大连理工大学

Degree:Doctoral Degree

School/Department:创新创业学院

Discipline:Mechanical Manufacture and Automation. Materials Surface Engineering. Plasma physics. Biomedical Engineering

Business Address:机械新大楼

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